Infineon Technologies AG has launched the CoolSiC MOSFETs 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency and power density. They
The post Infineon’s CoolSiC MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications appeared first on IoT Now News – How to run an IoT enabled business.
Read more here:: www.m2mnow.biz/feed/