Toradex has launched two new ultra-compact (30x30mm) System-on-Module (SoM) families: OSM and Lino, powered by NXP i.MX 91 or i.MX 93 Arm Cortex-A55 SoC for Edge industrial and IoT applications. The OSM iMX91 and OSM iMX93 variants comply with the OSM Size-S standard, featuring a 332-ball contact grid designed to be soldered to the carrier board. The Lino is a proprietary format that keeps the OSM Size-S dimensions but features two board-to-board (B2B) connectors offering more flexibility for potential replacement or future upgrades. Toradex Lino iMX91/iMX93 system-on-module Toradex Lino specifications: SoC (one or the other) NXP i.MX 93 CPU 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, and color space conversion NPU – Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS Security – EdgeLock Secure Enclave NXP i.MX 91 CPU – Single-core Arm Cortex-A55 […]
The post Toradex OSM and Lino SoMs – 30×30mm NXP i.MX 93/i.MX 91 modules with solder-down or B2B connector designs appeared first on CNX Software – Embedded Systems News.
Read more here: https://www.cnx-software.com/2026/03/31/toradex-osm-and-lino-soms-30x30mm-nxp-i-mx-93-i-mx-91-modules-with-solder-down-or-b2b-connector-designs/
