IPv6 and IoT News

Industry’s first 1TB automotive and industrial grade PCIe NVMe flash storage claimed by Micron

By Anasia D’mello

Micron Technology, Inc, a provider of memory and storage solutions, introduced the industry’s first 1TB automotive and industrial grade PCIe NVM solid state drive (SSD) in BGA and 22x30mm M.2 form factors at Electronica 2018.

Based on 64-layer triple-level cell (TLC) 3D NAND technology, the new Micron 2100 series of NVMe SSDs is designed for next-generation autonomous cars and the Industrial Internet of Things (IIoT).

As data requirements in connected cars with advanced driver-assistance systems (ADAS) and in-vehicle infotainment (IVI) increase, vehicles are transforming into data centres on wheels, requiring faster, reliable and cost-effective storage. In addition, the proliferation of edge computing and use of artificial intelligence (AI) in IIoT applications is driving a similar need for faster storage that is not supported by legacy interfaces like SATA and e.MMC.

“Strategy Analytics estimates that 1.8 million cars with Level 3 or higher autonomous driving capabilities will be sold in 2023. These cars are expected to require up to 1TB of flash storage for 3D maps, black box recording, sensor data and 4K infotainment content,” said Ian Riches, executive director of global automotive practice at Strategy Analytics.

“The introduction of Micron’s PCIe NVMe automotive SSD is a much-needed development toward overcoming the bandwidth, latency and capacity challenges of ADAS and is well-suited to service the storage needs of future self-driving cars.”

“As a leading innovator of memory and storage technologies, Micron has several decades of experience working with automotive and industrial manufacturers to address their challenges,” said Aravind Ramamoorthy, NAND product line senior director for Micron’s Embedded Business Unit. “The Micron 2100 SSD offers industry-providing capacity, performance, reliability and low-cost storage in a small form factor.”

Micron 2100 SSD key features include:

Superior performance – Up to 2000 MB/s reads and 1100 MB/s writes, >2X faster reads and >1.5X faster writes than UFS 2.1 and SATA 3 interfaces1
Highest capacity in small form factor – Available in 64GB to 1TB densities2 and 16x20mm BGA and 22x30mm M.2 form factors
Low-power – Optimised for reduced power consumption with lower estimated energy usage vs. UFS 2.13
Operating temperature – -40°C to 105°C and -40°C to 95°C Tcase
Storage interface – PCIe x4 Gen3, NVMe 1.3 with direct boot option, bypassing the need for another storage device for boot; NVMe shows >25% and >15% improvement in system write and read speeds, respectively, over SCSI software storage stack used in UFS4
Quality and reliability – AEC-Q100, IATF 16949-compliant
Automotive and industrial specific features – End-to-end data path protection, SLC partitioning support for high endurance, TCG Opal with self-encryption capability
Cost-effective – Based on industry-providing 64-layer TLC NAND with CMOS under array technology

“We are pleased that Micron is announcing the industry’s first automotive grade PCIe SSD based on TLC 3D NAND for next-generation IVI and ADAS systems,” said Nikolaus Bettinger, head of memory purchasing at Continental Automotive GmbH. “Micron’s automotive PCIe SSD offers the significantly higher performance, capacity and reliability needed for Continental’s next-generation autonomous driving solutions.”

“The new Micron 2100 SSD, with its extended operating temperature range, brings unprecedented storage performance and capacity for numerous industrial applications in a compact 16x20mm BGA form factor,” said Yves Desrochers, technology architect and industry relations at Kontron — An […]

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Arduino PRO Gateway for LoRa now available for pre-order

By Arduino Team

We are very happy to announce the Arduino PRO Gateway for LoRa!

Combined with Arduino MKR WAN 1300 IoT nodes, it makes an ideal solution for a wide range of applications, like smart agriculture, smart cities and building automation – and many other remote monitoring use cases requiring long range, low power wireless connectivity.

The gateway can be used globally and enables multiple channel management. By supporting advanced features like Listen Before Talk (LBT), it allows users to transmit at higher power on the first free channel, achieving longer ranges than conventional gateways for LoRa.

Arduino continues its mission of making complex technology easy enough for anyone to use. Customers of the Arduino PRO Gateway will be given exclusive beta access to the Arduino IoT Cloud, which makes installation, provisioning and remote management of the gateway incredibly simple through the popular Arduino Create cloud platform.

The gateway features the advanced Embit EMB-LR1301-mPCIe module, hosted by a Raspberry Pi 3 B+ SBC, in a rugged aluminum enclosure. The gateway comes pre-installed with an optimized packet forwarder and a carrier grade Network server for LoRa WAN that is running on the Arduino Cloud provided by A2A Smart City (part of the A2A Group).

Technical Specifications

  • Chipset: Semtech SX1301
  • Modulation: LoRa Spread Spectrum, FSK, GFSK 868MHz (EU) / 915MHz (US)
  • Number of Channels: 8 LoRa Channels
  • Operating Frequency: 868MHz (EU) / 915MHz (US)
  • Frequency Range: 860MHz to 1020MHz
  • Operating Temperature: -40°C to +85°C
  • RF Output Power: Up to +27dBm
  • Sensitivity: Up to -137dBm
  • Interfaces for the LoRa Module: mPCIe (SPI / I2C / UART / GPIOs) :
  • Dimensions: 71x40x1mm
  • Operating Voltage: +5V
  • Additional Features:
    • Listen Before Talk (LBT) Capability (for improved transmission power management),
    • On-board uFL antenna connector
    • FPGA support for LoRa Spectral Scan

The Arduino Pro Gateway for LoRa (868 MHz , EU version) can be pre-ordered from the Arduino Store.

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Avnet and Octonion Working to Deliver AI and Security at the Edge

By A.R. Guess

A recent press release reports, “Success in today’s Internet of Things (IoT) marketplace requires unique combinations of hardware, software and security delivered in a timely manner to solve complex technical requirements. Now entrepreneurs and creators can expect to have a new solution that leverages Artificial Intelligence (AI) to help speed the development process through a […]

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IoT partner programmes choosing depth over breadth as maturity grows and enrolment falls

By Anasia D’mello

In its recent analysis ranking 547 companies on their IoT service capabilities, ABI Research, a market-foresight advisory firm providing strategic guidance on the most compelling transformative technologies, finds that partner programmes and their member companies are continuing to mature in their IoT offerings while simultaneously decreasing the average number of members per partner program.

In fact, 65% of listed organisations received a high IoT maturity grade, which is nearly 2½ times the number of organisations that received a high maturity ranking when ABI Research first analysed these IoT ecosystems back in September 2015. Partner program parents such as Amazon Web Services, Dell, and IBM are aligning themselves with fewer, higher-value partners who can better help end-users navigate the convoluted IoT ecosystem.

“Size matters when it comes to these partner programs,” says Ryan Harbison, research analyst at ABI Research. “While it’s tempting for many of these partner programs to have the highest number of partners, eventually there’s a breaking point where the partner program is just as difficult for end-users to navigate the overall IoT ecosystem. As a result, the most successful partner programs today have focused on forging new alliances with a smaller number of like-minded and more established partners across multiple sectors to a broader range of customers.”

Partner program parents need to ensure that their partners can effectively address the current major needs of the market while also addressing high-growth niche vertical markets, with companies like Dell and AWS showing that it’s possible to address these changing market dynamics without being encumbered by hundreds of partners. AWS’ IoT Competency program ensures that its partners have a high-depth of IoT expertise to meet end-user needs, while Dell’s IoT Solutions Partner Ecosystem is focused on having both technology and services partners who can address specific use cases.

The three most targeted verticals within these partner program ecosystems have consistently been healthcare, manufacturing, and energy applications, but over the past three years, there has been a remarkable increase in the number of partners offering solutions targeting the digital signage, wearable, and smart building markets due to end-user demand.

“The most successful partner programs are the ones that strike the right balance between the breadth and depth of their partner program offering,” concludes Harbison. “Enterprises and end-users across all vertical markets will continue to turn to these ecosystems to more effectively navigate the otherwise fragmented technology and supplier landscape.”

These findings are from ABI Research’s SI/VAR and Partner Program IoT Ecosystem Market Data report.

Comment on this article below or via Twitter: @IoTNow_OR @jcIoTnow

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