Infineon’s CoolSiC MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications
By Marion Webber Infineon Technologies AG has launched the CoolSiC MOSFETs 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency and power density. They The...
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